DownStream 2016 CAM350 12.2-BluePrint-PCB 5.2

DownStream provides an economical and holistic solution to PCB post processing that enables engineers and designers to quickly create the key deliverables for PCB fabrication, assembly and testing. DownStream's tools combine comprehensive feature sets to handle complex designs with a very easy-to-use interface, allowing even the infrequent user the ability to generate PCB artwork, design validation, and bare board and assembly drawings and documents.

- CAM350/DFMStream
CAM350 is the industry de facto standard for verification, optimization and output generation to efficiently and effectively drive PCB fabrication.
DFMStream is a comprehensive, yet easy-to-use tool suite designed to help engineers and designers verify design and manufacturing rules on PCB design databases, Gerber and NC data any time during the PCB design cycle. DFMStream also fosters collaboration between you and your fabricator.
- BluePrint-PCB
BluePrint-PCB works your PCB CAD system and/or CAM350 to help you quickly produce comprehensive electronic drawings to drive PCB fabrication, assembly and inspection processes.
DownStream Technologies, LLC is a progressive software company focused on helping high-tech engineering organizations automate the PCB Release Process. We deliver solutions that allow engineering and manufacturing teams to work together to transition Printed Circuit Boards (PCB) designs into successful, physical products.

DownStream's solutions redefine how engineering professionals post process PCB designs to create and distribute all the deliverables required for a complete PCB assembly release package. CAM350 provides verification, optimization, and output generation to efficiently drive PCB fabrication. BluePrint for Printed Circuit Boards works with CAM350 and PCB CAD systems to help quickly produce comprehensive electronic drawings to drive PCB fabrication, assembly, and inspection.

Here are some key features of "DownStream Products":
- Less than minimal spacing between design objects including pads, tracks, copper, drills, vias of all types including blind, buried, laser and back drilled.
- Less than minimal annular rings of pad, copper, or mask.
- Less than minimal spacing between SMD or Through hole pads or parts.
- Copper and mask slivers and pin holes.
- Acid traps, solder bridge potential, isolated or starved thermal reliefs or trace antennas.
- Minimal mask spacing, Missing paste, missing solder mask, extra mask areas, or poor mask to pad ratios.
- Overlapping, coincidental or redundant drills, mill path errors and poor drill to board thickness ratio.
- And many other error types