اصول تکنولوژی لحیم کاری اتصال سرب: از ریزساختار به قابلیت اطمینان Fundamentals of Lead-Free Solder Interconnect Technology: From Microstructures to Reliability
- نوع فایل : کتاب
- زبان : انگلیسی
- نویسنده : Tae-Kyu Lee
- چاپ و سال / کشور: 2015
- شابک / ISBN : 978-1-4614-9265-8, 978-1-4614-9266-5
Description
This unique book provides an up-to-date overview of the concepts behind lead-free soldering techniques. Readers will find a description of the physical and mechanical properties of lead-free solders, in addition to lead-free electronics and solder alloys. Additional topics covered include the reliability of lead-free soldering, tin whiskering and electromigration, in addition to emerging technologies and research.